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Contact angle measuring instrument with 3 axis wafer handling robot for 200 and 300 mm technology, Loadport for 300mm-FOUP and / or 200mm-OCL
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GENERAL SOFTWARE
3 user levels connection to SPC via network interface card operating system Windows XP/7 automatic loadport recognition automatic recognition of slot occupancy automatic measurement recipes assigned to certain load port (recipe mix up between different wafer sizes is avoided) slot integrity is warranted notching before measurement Measurement data will be stored on local disc – any backup storage on network server will be organized by customer LAN compatible Client software for result evaluation on office PC is included Manual operation mode (via joystick)
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MEASUREMENT
GENERAL Automatic, motorized dispense System Syringe for one media (DI-water) Tank with 10 ml media stock Programmable droplet size Automatic placement of the droplet on the wafer, movement for droplet placement is programmable Easy disassembly/cleaning of the dispense system System capable for measurements with second liquid
Image: Tool inside setup showing wafer roboter and dispensation system |
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MEASUREMENT Tool/Software supports free definable measurement maps The whole wafer surface for 12" must be in reach for the dispense system (excluding edge area) Complete automatic measurement (FOUP -> droplet placement -> measurement -> droplet removal -> FOUP) |
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GENERAL HARDWARE Wafer handling capability for 12" wafer / and or 8" wafers System guarantees slot integrity Manual focus system, OEG provides detailed instruction for focus adjustment OEG provides concept for maintenance, spare parts, complete users guide OEG provides instruction for change of syringe Wafer chuck only defined by measurement characteristics Air pressure, vacuum, exhaust is provided by customer Customer provides 300mm wafers plus FOUPs for development system setup After measurement liquid will be evaporated by hotplate (optional) Work place contains keyboard and mouse
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TOOL CONFIGURATION Configuration - unit description:
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Technical Parameters for contact angle measurement Contact angle measuring device SURFTENS 300 WH for the fully automatic measurement of the wetting behavior of solids (e.g. wafers or glass substrates for flat panel displays) under clean-room conditions, as well as for series tests and systematic analysis. The SURFTENS automatic enables the reduction of subjective factors and time involved for contact angle measurements in research, quality- and production inspection.
SURFTENS 300 WH features the software-controlled measurement and analysis of:
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The SURFTENS WH 300 consists of the basic instrument with the following technical equipment:
Technical data for contact angle measurement
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