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SURFTENS 300 WH

Contact angle measuring instrument with 3 axis wafer handling robot for 200 and 300 mm technology

 

 

 

 

 

 

 

 

 

 

 

GENERAL SOFTWARE
  • implementation of user levels in software
  • connection to SPC via network interface card
  • operating system Windows 2000
  • automatic loadport recognition
  • automatic recognition of slot occupancy
  • automatic measurement recipes assigned to certain load port (recipe mix up between different wafer sizes is avoided)
  • slot integrity is warranted
  • notching before measurement
  • Measurement data will be stored on local disc – any backup storage on network server will be organized by customer
  • LAN compatible
  • Client software for result evaluation on office PC is included
  • Manual operation mode (via joystick)

MEASUREMENT GENERAL
  • Dispense System
  • Syringe or other dispense system for one media (DI-water)
  • Tank with 10 ml media stock
  • Programmable droplet size
  • Automatic placement of the droplet on the wafer, movement for droplet placement is programmable
  • Easy disassembly/cleaning of the dispense system
  • System capable for measurements with second liquid

MEASUREMENT
  • Tool/Software supports free definable measurement maps
  • The whole wafer surface for 12" must be in reach for the dispense system (excluding edge area)
  • Complete automatic measurement (FOUP -> droplet placement -> measurement -> droplet removal -> FOUP)
  • contact angles between 85° and 95° will be excluded from measurement range of the tool

GENERAL HARDWARE

  • Wafer handling capability for 12" wafer / and or 8" wafers
  • System guarantees slot integrity
  • Manual focus system OEG provides detailed instruction for focus adjustment
  • OEG provides concept for maintenance, spare parts, complete users guide
  • OEG provides instruction for change of syringe
  • Wafer chuck only defined by measurement characteristics
  • Air pressure, vacuum, exhaust is provided by customer
  • Customer provides 300mm wafers plus FOUPs for development system setup
  • After measurement liquid will be evaporated by hotplate
  • Work place contains keyboard and mouse

TOOL CONFIGURATION

Configuration - unit description:

No Item   Description
1 Wafer handling system   3-axis wafer handling robot

FOUP opening system 300mm

Loadport (OCL) 200mm

Laser scanner

Vacuum endeffector

Notching system
2 SURFTENS automatic   3-axis-step motor

stepping motor driven wafer table

automatic dispense system

automatic droplet positioning (teachable)

illumination system

CCD camera with optics

Frame grabber

Fan Filter Unit (FFU, on customer request)

Software package
3 Hotplate   for liquid removal only on customer request)
4 PC   PC, Flatscreen, keyboard, mouse

 

Technical Parameters for contact angle measurement

Contact angle measuring device SURFTENS 300 WH for the fully automatic measurement of the wetting behavior of solids (e.g. wafers or glass substrates for flat panel displays) under clean-room conditions, as well as for series tests and systematic analysis. The SURFTENS automatic enables the reduction of subjective factors and time involved for contact angle measurements in research, quality- and production inspection.

For the software-controlled measurement and analysis of:

  • the static and dynamic contact angle according to the Sessile Drop method;
  • the wetting behavior on solid surfaces
  • the surface free energy of solids and their components

The SURFTENS WH 300 consists of the basic instrument with the following technical equipment:

  • Single needle support with vertical and horizontal positioning;
  • Measuring stage, for fully automatic accurate sample positioning;
  • telecentric measuring lens;
  • Video measuring system with high-resolution CCD-camera;
  • High-performance video digitizing board (frame grabber) for the PC;
  • Illumination with continuously adjustable intensity for a homogeneous back lighting;
  • Control and measuring electronics for the teach-in procedure, graphic display with keyboard and video display
  • Power supply by PC
  • The 32-bit software SURFTENS developed for Windows NT/98/XP®;
  • Control of the sample position in X-, Y-direction, the needle position in Z-direction,
  • Static and dynamic contact angle measurement according to the Sessile drop method
  • Calculation of the surface and interfacial tension from the sessile drops
  • Calculation of the surface free energy of solids and their components according to the theory of Wu,
  • Statistics and measurement error analysis
  • 3 axis wafer handling robot
  • Loadport for 300mm wafer
  • scanner for slot occupancy
  • housing

 

Technical data for contact angle measurement
  • sample size: 200mm / 300mm Si-Wafer
  • Position accuracy ± 0.05 mm in the sample level;
  • Range of contact angle measurement 1° … 180°
  • Measuring methods: Sessile Drop method
  • Clean-room classification: 100 (better on inquiry)


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