Instruments for semiconductor technology

 

Video measuring systems, contact angle measurement, diamond scriber, Waferstress, glas thickness measurement, development rate monitor


OEG
Optik
Elektronik
Gerätetechnik






 

OEG offers software and turn-key measurement- and sample preparation-stations for the semiconductor industries

 

 

For detailed information, please follow the links below:


Critical dimension (CD) measurement, product line COMEF

Software for image processing and documentation – for all objects, which can be imaged optically!


Contact angle meters, product line SURFTENS

Contact angle, free surface energy and surface tension meters. OEG offers a wide range of contact angle meters, beginning with cost effective manual instruments up to fully automated robots SURFTENS WH


Precision micro diamond scriber MR200

Precision micro diamond scriber MR 200 for manual scribing and cutting of structured silicon wafers


 

Thin film stress ( Waferstress ) measurement 2D/3D, product line FLATSCAN

Deflectometer for automated 2D/3D-measurement of slope and surface curvature with software module for thin film stress ( wafer stress)

 

Demo Video

 


 

FLATSCAN CAS - thickness / flatness measurement for all kind of transparent objects

FLATSCAN CAS provides highly accurate, non contact thickness measurement of all kinds of transparent objects like glass substrates and glass wafers. Additionally the flatness measurement is possible

 

 

Demo Video


Development rate monitor LMP

The measuring instrument helps to draw conclusions about the parameters of resists such as the sensitiveness and gradation and the influence ofdifferent developers on the dismantling behaviour. Furthermore the Dill parameters A, B and C can be measured as entry parameters for the photo lithography simulation.




OEG Gesellschaft für Optik, Elektronik & Gerätetechnik mbH · Wildbahn 8i · D-15236 Frankfurt · +49 (0)335 5213894 · +49 (0)335 5213896