FLATSCAN TF
Measurement of Thickness and Flatness of Glass
Substrates
for Wafer Mounting Technology
Non contact thickness measuring of glass and cementing layer
FLATSCAN WMT provides highly accurate, non contact thickness measuring of all kinds of transparent objects. For use in Wafer Mounting Technology FLATSCAN is able to measure the common thickness of glass substrate and cementing layer.
High resolution thickness sensor guarantees precise measurements
Basis of the measuring instrument is the high resolution thickness sensor CAS for transparent objects. Comfortable Windows-Software allows single measurements and automatic thickness mappings The comfortable Windows software controls the measuring and
offers graphical and numerical data evaluation and representation, for instance 3D-representation of thickness distributions and sectional views.
The measuring results can be stored in freely configurable measuring protocols or in ASCII-Files.
The standard measuring field is (150 x 150) mm. Any other measuring field is
possible (see Flatscan 650).
Technical Data